SemiConductor
Semiconductor applications encompass advanced packaging, wafer-level micro-optics, RFID chip bonding, smart card packaging, carrier wafer glass, and heated foam films. Utilizing materials such as DELO adhesive, SOMAR heating film, and Schott glass.
DELO adhesives play a crucial role in semiconductor-based equipment. DELO semiconductor adhesives are used to bond, contact, and encapsulate wafers and other SMD components on printed circuit boards. DELO also develops specialized products for the advanced packaging industry. These products help improve packaging performance.
SOMAR provides heated foaming film products for the semiconductor industry, which are widely used in MLCC dicing. As chips (such as Micro-LEDs/RFID) become increasingly smaller, wafer dicing often results in problems such as difficulty in extraction and residual adhesive. This product perfectly solves these problems.
SCHOTT carrier wafers and carrier panels are commonly used to manufacture basic components such as 3D ICs and FO-WLPs. To withstand the high temperatures required for semiconductor manufacturing, carrier wafers and panels typically use materials with high thermal stability.
SCHOTT offers a range of products with a wide range of thermal expansion coefficients, thicknesses, and geometric properties.
